Samsung Exynos 2400 will use newer FOWLP layering for lower power consumption

Samsung will soon launch its Exynos 2400 mobile chipset. Samsung chipsets are good, but almost all of them have an issue related to thermal power management which results in overheating and throttling of the chipset. However, the brand seems to be implementing a new technology in their upcoming Exynos 2400 chipset which would reportedly fix these issues.

Samsung will use FOWLP layering in upcoming Exynos 2400

Samsung has completed the verification of the fan-out wafer-level packaging (FOWLP) process and has begun delivering products to customers, according to the Korean news website EDaily. The Exynos 2400 chip, which will be added to the Galaxy S24/S24+ mobile phones next year, will be the first to use the aforementioned layering process.

Previous reports claim that Samsung intended to use FOWLP technology for the Exynos 2400 processor to catch up to Qualcomm Snapdragon. FOWLP technology is regarded as a critical technology for improving the performance of semiconductor chips, as well as one of the crucial magic weapons for Samsung to catch up with TSMC.

The current standard for semiconductor chip packaging requires that the chips be connected to a PCB (Printed Circuit Board) in order to stack them, whereas FOWLP does not require a PCB because the chips are directly connected to the wafer. As a result, it is both cheaper and better.

Not only this, the future upcoming Samsung chipsets will continue the use of this newer technology to achieve better sustainable performance and power management. The brand plans to achieve mass production of chipsets layered with FOWLP starting next year.

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