Qualcomm has recently introduced its Snapdragon 7 Gen 3 mobile chipset in the market. Positioned between the 7+ Gen 1 and 7 Gen 2, this chipset comes with less powerful specifications, but at a more affordable price, which aligns with the brand’s sustainable approach. The company’s major competitor, MediaTek, has released the Dimensity 8300 chipset to compete with Snapdragon 7 Gen 3.
What does MediaTek Dimensity 8300 bring to the table?
The newly launched MediaTek Dimensity 8300 chipset is based on TSMC’s 2nd generation 4nm fabrication technology. It’s an octa-core chipset that comes with a 4+4 core combination. There are 4X ARM Cortex A715 which serves as performance cores and 4X ARM Cortex A510 which serves as power-saving cores.
According to the brand, the chipset would be able to give a performance boost of as much as 20% compared to its predecessor. Not only this, the chipset is claimed to be 30% more power efficient than its predecessor.
Consider this phone to have a Mali G615 MC6 GPU that has been supercharged. This new graphics powerhouse not only provides 60% more oomph but also consumes 55% less power.
Let us now discuss the brains behind the operation. The AI capabilities of the chipset were the star of the show at its launch. A special APU 780 AI processor is housed within. It is capable of handling complex AI tasks such as running generative models with up to 10 billion parameters.
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